PCB SolderMask-Finished Pattern Inspection system


Model Comparison


【 Introduction 】

Model DVI-M1 DVI-P2 DVI-A3 GTS-V2
Inspection mode IC Substrate (BGA, CSP, FC, etc.), HDI
Type of defect Not covered with solder mask area line: Bond-Finger / PAD of size inspect, gold-plating surface is bad, gold misplating, foreign object, defect, shifted, Deep Scratch, contamination, the minimum line width inspection, the minimum line space inspection.
Defects below the solder mask layer: short circuit, open circuit, poor filling.
The min. line/space width of inspecting 15um
Resolution 5.5 um/pixel ~1.5 um/pixel 5.16-1.55um/pixel
Inspection mode Die To Die, Die To Golden
Object type Unit / Strip Panel / Unit / Strip Unit / Strip Unit / Strip
Object size (mm) 300x200 945x790 300x200 610x520
Inspection range 300x200 880x700 300x200 360x360
Test time(sec) @275*75mm <30s@ 2.75um/pixel <30s@ 2.75um/pixel    
Automatically flipped
Automatic load/unload the material